HM0360 Ultralow Power CIS for Low Energy, Smart Camera Applications
640 x 480 60FPSMAX 1/6″ 8b Parallel & MIPI
The HM0360 is an ultralow power, Back Side Illuminated (BSI) CMOS Image Sensor designed for energy efficient smart vision applications, such as object-specific classification, tracking, and identification. The VGA resolution is ideal for monitoring, detection and image capture for wide field of view camera devices.
The HM0360 uses Himax Imaging’s advanced 3.6µ deep diode pixel and proprietary readout design to achieve superior low light performance while consuming only 140µA in QVGA 2FPS and approximately 7mA in VGA 60 frames per second read out mode.
To reduce camera system latency and power consumption, the HM0360 features on-chip self-oscillator, real time clock, fast initialization, <2ms frame trigger, context switching and instant frame update. The sensor provides several monitoring options with programmable interrupt thereby allowing the host processor to be placed in low power standby until notified by the sensor.
The HM0360 is available in a compact Chip Scale Package (CSP) and supports multiple power supply configurations with minimal passive components to enable a highly compact camera module design for next generation smart camera devices.
Features
- Ultralow power, high sensitivity, low noise VGA sensor
- Operates approximately 7mA VGA 60FPS to 140µA in QVGA 2FPS mode
- Automatic wake and sleep operation with programmable event interrupt to host processor
- On-chip auto exposure / gain and zone detection
- Pre-metered exposure provides well exposed first frame and after extended sleep (blanking) period
- Flexible binning, subsampling and region of interest
- External frame synchronization and stereo camera support
- Embedded line provides metadata such as frame count, AE statistics, zone trigger and other interrupt event information
- 1-lane MIPI CSI2 and 8bit CMOS level video interface that supports 1b, 4b and 8b protocol
- I2C 2-wire serial interface supporting burst operation for fast register access
- <13mm² CSP sensor package size
- High CRA for low profile module design
Sensor Parameters
Active Pixel Array | 656 x 496 |
Pixel Size / Technology | 3.6 µm x 3.6 µm / BSI |
Diagonal (Optical Format) | 2.88 mm (1/6″) |
Color Filter Array | Bayer, Monochrome |
Frame Rate @ 24MHz | QQVGA 1FPS to VGA 60FPS |
Readout Modes | Full (VGA), Bin2 (Mono) / Sub2, Bin4 (Mono) / Sub4, Fast ROI |
S/N Ratiomax | 45.5dB |
Dynamic Range (1x) | 85dB |
Sensitivity | 5.5 V / Lux-sec @ 530nm 15 V / (uW-cm-2 sec) @ 850nm |
CRA (maximum) | 35.74º |
Sensor Specifications
Supply Voltage Analog Supply Voltage Digital Supply Voltage I/O | 2.8 V 1.2V (1.8V LDO option) 1.8 – 3.0V |
Reference Clock (EXTCLK) | 6 – 24 MHz |
Internal Oscillator | Yes |
Serial Interface | I²C (1MHz max., single / burst) |
MIPI Data Format | 8b |
CMOS Data Format | 8b, 4b+4b / 4b / 1b |
Current Consumption (8b parallel, >5pF load) | QVGA (S2) 2FPS 140 µA QVGA 60FPS 3.2 mA VGA 60FPS 7 mA |